Senior Electronics Engineer--某美资全球研发中心,牙科领域

主要工作职能 Major Accountabilities:

1. 为电子系统创建子组件和详细的零部件电路原理图和 PCB 设计。

Create sub assembly and detail component schematic and PCB design for electrical system.

2. 负责电路板的DVT测试和文档编写。

Responsible for design verification testing and documentation of circuit board.

3. 负责当前产品的维护,包括元器件的EOL、问题调试、设计变更等。

Responsible for routine work of CPE, it will cover materials’ EOL, issue debug and design change, and so forth.

4. 与其他部门工程师进行交流和沟通,并根据项目需要进行合作开发。

Communicate with other function engineers to co-develop system as project needs.

5. 在需求定义、预算和进度估计等设计活动中担任重要的职务。

Major design activity for requirements definition, budget and schedule estimation.

6. 在产品的生命周期内支持生产、采购和服务团队。

Support Manufacturing, Purchasing and Service team through product life cycle.

7. 与外部分包商和内部机构合作,完成设计的实现和制造。

Work with external subcontractors and internal facilities for design implementation and manufacturing.

录用要求 Requirements:

1. 电子工程、电气工程或相关教育背景的本科或硕士学历;

Bachelor/Master degree in Electronic engineering, electrical engineering or related education background

2. 5 年(本科)或 3 年(硕士)以上电子电路设计或制造的工作经验;

Bachelor over 7 years or Master over 5 years working experiences in electronic circuit design or manufacturing

3. 模拟/数字电路和微控制器/处理器的硬件设计经验;

Analogue/digital circuit and Micro controller/processor hardware design experiences

4. 能够独立设计电子电路系统(从电路原理图到 PCB 布局布线)。

Capable of designing electronic system from schematic to PCB layout independently

5. 能够熟练使用 Cadence Oracd/Allegro 设计工具。

Very skillful in Cadence Oracd/Allegro design tools

6. 具备较强的电气设计分析能力:EMC/EMI、热分析。

Experienced in electrical design analysis capability: EMC/EMI, Thermal

7. 熟悉 PCB 制造加工技术及应用。

Familiar with PCB manufacturing processing technology and application